Manufacturing Capabilities
What we can build. If your design pushes past a limit below, send it anyway — high-difficulty is our specialty, and an engineer will confirm feasibility.
- Base materials
- FR-4, Metal-core (Al / Cu / Fe), Copper base, Ceramic, High-frequency
- Max layers
- Up to 32 layers
- Copper weight
- 1 oz – 10 oz (heavy copper)
- Min trace / space
- 3 mil / 3 mil
- Min hole size
- 0.15 mm (mechanical), laser vias available
- Via technology
- Through / Blind / Buried / HDI, resin plug, POFV
- Thermal conductivity (MCPCB)
- 1.0 – 3.0+ W/m·K
- Surface finish
- HASL, Lead-free HASL, ENIG, OSP, Immersion silver
- Impedance control
- Yes, ±10%